Film adhesion testing of thin films and stacks on substrates for material evaluation.
Modified Edge Liftoff Test to measure adhesion of thin film and thin film stacks on a wide variety of crystalline and non-crystaline substrates, such as Silicon, III-V compounds, glass, etc. Suitable for mid adhesion samples.
4-Point Bend film adhesion test. Measurement in air or liquid. For low to mid adhesion samples. Multi-chamber option for rapid testing.
Frontier Semiconductor moved to its new location: 165 Topaz St., Milpitas, CA 95035, USA.May 01, 2018
FSM will be presenting at Semicon West in San Francisco, Ca, July 10-12, 2018. Please visit us at booth #2332 in the South Hall.Jul 10, 2018
FSM will be presenting at SPIE Optics and Photonics Conference in San Diego.Aug 20, 2018
FSM will be presenting at SPIE The international society for optics and photonics - DEFENSE COMMERCIAL SENSINGApr 16, 2019