Welcome to Frontier Semiconductor

Frontier Semiconductor, Inc, (FSM), offers a range of advanced metrology products and solutions for semiconductor, LED, Solar, FPD, Data Storage and MEMS applications. We have over 25 years experience in stress measurement, film adhesion testing, wafer topography metrology, and electrical characterization. Our latest offerings include unique technology to meet the metrology needs of 3DIC manufacturing and to monitor stress of large flat panels.

FSM has local sales and support offices in all major semiconductor clusters. Other areas are covered by a network of local representatives.

Applications domains & Technologies

FSM offers metrology and characterization systems for front-end, back-end, as well as research and development applications.

900 Series

Stress Hysteresis in vacuum or gas up to 900C for the study of annealing cycles. Thermal Desorption, Film Shrinkage, Reflectivity, and Resistivity options provide additional insight to causes of material changes with temperature. NEW: Optional wafer rotation offers unique 2D/3D mapping to study wafer deformation as a function of temperature.


900 C2C900TC-VAC
500 Series

Stress Hysteresis Measurement up to 500C for thermal property and stability tests of thin films in inert gas. Non-Contact Laser Scanning Technology.


500TC
Raman 360 and FSM127

Local and Lattice Stress Measurement, Die level Topography. For in-die and in-device stress and composition control.


Raman-360
VIT(E) Series

Virtual Interface Technology for 3D-IC Metrology: TSV profile (depth, top & bottom CD) , Remaining Silicon Thickness (RST), Copper Nail Height, Bump Height and Cu pillar Height, Edge trim profile.


VIT C2C8108 VITE
Adhesion Testers

Film adhesion testing of thin films and stacks on substrates for material evaluation.


MELTAquaflex
413 Series

Substrate and tape total and individual thicknesses, warpage, and TTV Measurement. Able to measure with or without backing tape. For wafer back-grind and etch thinning processes control. Non-contact Echoprobe or VITE Technology. Thin film and surface roughness options.


413 C2C413 SA413 PR413MOT
128 Series

Frontier Semiconductor is the leading manufacturer of stress measurement tools for semiconductor, MEMS, optoelectronic, and flat panel applications. Stress and wafer bow maps can be acquired over the entire wafer surface, providing process engineers means to characterize and develop new processes using different thin film materials.

The FSM 128 Series systems are room temperature,  full-wafer 2D/3D stress mapping systems. 128 systems use FSM's patented non-contact Opti-Lever dual-laser auto-switching technology. Ability to scan 1000 points per inch in seconds for high resolution, high precision stress mapping on blanked and patterned wafers.


128L C2C128L128NT128G-450128 C2C
Electrical Characterization

Contact and Non-Contact sheet resistance measurement systems for implantation, diffusion, metallization, and many other applications.


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Products

17 Product lines... Click here for more details



8108 VITE VIT(E) Series

New high speed, high accuracy non-contact characterization of thin wafers, through silicon vias (TSV), bumps, MEMS structures and novel materials. FSM 8108 VITE can be employed in the front-end and backend. It provides thickness, TTV, and topography of Si and compound materials, edge trim geometry, multilayer thickness and topography of wafers on tape, on sapphie,or on glass. Measurement of warp of highly warped wafers and measurement of  thick films.



413 C2C 413 Series

Thickness and total thickness variation (TTV) mapping system. TTV and Thickness of wafer substrate, thick layers, wafers on tape, bonded wafers, etc. Fully automated cassette to cassette system, SECS/GEM compliant. Warp, Roughness, and Thin Film Thickness measurement options.



128L C2C 128 Series

Dedicated Film Stress mapping system with high resolution for high throughput process control. Fully automated cassette to cassette, SECS/GEM compliant 300mm Film Stress and Bow Measurement tool. Dual or single FOUP configurations available. Integrated wafer substrate thickness measurement available. 

 

North America

Frontier Semiconductor

Corporate Head Office

Tel: +1 408 432 8838
Fax: +1 408 232 1115
fsm100@frontiersemi.com

2127 Ringwood Avenue,
San Jose CA 95131

FSM Europe

Adrian Cailean

Sales & Service

Tel: +33 (0) 676 494 487
Fax: +33(0)4 76 35 77 61
adrianc@frontiersemi.com

196C Rue du Rocher de Lorzier, 38430 Moirans, France

FSM Korea

Shawn(Sung-Hyun) Kwon

Sales & Service

Tel: +82-31-8015-5458
Fax: +82-31-8015-5459
shawnk@frontiersemi.com

Paragon-II #307, 106-1, Bansong-dong, Hwasung-si, Gyeonggi-do, Korea, 445-811

FSM Taiwan

Alex Cheng

Sales & Service

Tel: +886-3-658-7061
Fax: +886-3-658-9600
AlexCheng@frontiersemi.com

Jhubei City, Hsinchu County 302, Taiwan (R.O.C.)

FSM China Sales Representative

Tony Huang

Sales & Service

Tel: +86 20 83295780
Fax: +862083295780
admin@apolloswing.com

48 Baqier Rd, Hangyun Plaza 1011, Guangzhou China

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FSM will be introducing the new FSM 8108 VITE system at the FCMN 2017 in Monterey. FSM 8108 VITE is based on the Frequency Space Moire Effect, which provides high speed, high accuracy dimensional metrology.


Mar 21, 2017

FSM will exhibit and present at 2017 MRS Spring Meeting. Booth number 504. Please visit.


Apr 17, 2017

FSM will exhibit and present at FCMN 2017. We will be introducing our latest metrology solutions for thinned wafer thickness measurement and other application. Talk to us also about our new high temperature vacuum characterization chamber with wafer rotation.


Mar 21, 2017