Welcome to Frontier Semiconductor

Frontier Semiconductor, Inc, (FSM), offers a range of advanced metrology products and solutions for semiconductor, LED, Solar, FPD, Data Storage and MEMS applications. We have over 25 years experience in stress measurement, film adhesion testing, wafer topography metrology, and electrical characterization. Our latest offerings include unique technology to meet the metrology needs of 3DIC manufacturing and to monitor stress of large flat panels.

FSM has local sales and support offices in all major semiconductor clusters. Other areas are covered by a network of local representatives.

Applications domains & Technologies

FSM offers metrology and characterization systems for front-end, back-end, as well as research and development applications.

413 Series

Substrate and tape total and individual thicknesses, warpage, and TTV Measurement. Able to measure with or without backing tape. For wafer back-grind and etch thinning processes control. Non-contact Echoprobe or VITE Technology. Thin film and surface roughness options.

413 C2C413 SA413 PR413MOT
900 Series

Stress Hysteresis in vacuum or gas up to 900C for the study of annealing cycles. Thermal Desorption, Film Shrinkage, Reflectivity, and Resistivity options provide additional insight to causes of material changes with temperature. NEW: Optional wafer rotation offers unique 2D/3D mapping to study wafer deformation as a function of temperature.

900 C2C900TC-VAC
128 Series

Frontier Semiconductor is the leading manufacturer of stress measurement tools for semiconductor, MEMS, optoelectronic, and flat panel applications. Stress and wafer bow maps can be acquired over the entire wafer surface, providing process engineers means to characterize and develop new processes using different thin film materials.

The FSM 128 Series systems are room temperature,  full-wafer 2D/3D stress mapping systems. 128 systems use FSM's patented non-contact Opti-Lever dual-laser auto-switching technology featuring a micropositioning detector to measure the laser beam deflection with high precision over a large dynamic range of small to large bow or stress. FSM's stress gauges have the ability to scan 1000 points per inch in seconds for high resolution, high precision stress mapping on blanked and patterned wafers.

128L C2C128L128NT128G-450128 C2C

In-Situ Roughness Monitoring of very rough surfaces such as those of diffusers for LED and Laser light sources, as well as silicon and compound semiconductor solar cells.

Raman 360 and FSM127

Local and Lattice Stress Measurement, Die level Topography. For in-die and in-device stress and composition control.

Raman-360127 C2C
VIT(E) Series

Virtual Interface Technology for 3D-IC Metrology: TSV profile (depth, top & bottom CD) , Remaining Silicon Thickness (RST), Copper Nail Height, Bump Height and Cu pillar Height, Edge trim profile.

500 Series

Stress Hysteresis Measurement up to 500C for thermal property and stability tests of thin films in inert gas. Non-Contact Laser Scanning Technology.

Electrical Characterization

Contact and Non-Contact sheet resistance measurement systems for implantation, diffusion, metallization, and many other applications.

Adhesion Testers

Film adhesion testing of thin films and stacks on substrates for material evaluation.



21 Product lines... Click here for more details


The FSM RMS In-Situ Roughness Monitoring System is a compact, robust, and easy to use system to measure the roughness of very rough surfaces such as those of diffusers for LED and Laser light sources, as well as silicon and compound semiconductor solar cells. FSM’s proprietary non-contact grazing angle scattering technology makes the system immune to stray light and vibration and easy to integrate.

8108 VITE VIT(E) Series

New high speed, high accuracy non-contact characterization of thin wafers, through silicon vias (TSV), bumps, MEMS structures and novel materials. FSM 8108 VITE can be employed in the front-end and backend. It provides thickness, TTV, and topography of Si and compound materials, edge trim geometry, multilayer thickness and topography of wafers on tape, on sapphie,or on glass. Measurement of warp of highly warped wafers and measurement of  thick films.

413 C2C 413 Series

Thickness and total thickness variation (TTV) mapping system. TTV and Thickness of wafer substrate, thick layers, wafers on tape, bonded wafers, etc. Fully automated cassette to cassette system, SECS/GEM compliant. Warp, Roughness, and Thin Film Thickness measurement options.

North America

Frontier Semiconductor

Corporate Head Office

Tel: +1 408 432 8838
Fax: +1 408 232 1115

2127 Ringwood Avenue,
San Jose CA 95131

FSM Europe

Adrian Cailean

Sales & Service

Tel: +33 (0) 676 494 487
Fax: +33(0)4 76 35 77 61

196C Rue du Rocher de Lorzier, 38430 Moirans, France

FSM Korea

Shawn(Sung-Hyun) Kwon

Sales & Service

Tel: +82-31-8015-5458
Fax: +82-31-8015-5459

Paragon-II #307, 106-1, Bansong-dong, Hwasung-si, Gyeonggi-do, Korea, 445-811

FSM Taiwan

Alex Cheng

Sales & Service

Tel: +886-3-658-7061
Fax: +886-3-658-9600

Jhubei City, Hsinchu County 302, Taiwan (R.O.C.)

FSM China Sales Representative

Tony Huang

Sales & Service

Tel: +86 20 83295780
Fax: +862083295780

48 Baqier Rd, Hangyun Plaza 1011, Guangzhou China

Email Inquiry

Name *
Email to reply *
Phone/Mobile *
Interested in Product

FSM will be introducing the new FSM 8108 VITE system at the FCMN 2017 in Monterey. FSM 8108 VITE is based on the Frequency Space Moire Effect, which provides high speed, high accuracy dimensional metrology.

Mar 21, 2017

FSM will exhibit and present at 2017 MRS Spring Meeting. Booth number 504. Please visit.

Apr 17, 2017

FSM will exhibit at Semicon West July 11-13, 2017. Booth #5151. We will be introducing our latest metrology solutions for thinned wafer thickness measurement and other application. Talk to us also about our new high temperature vacuum characterization chamber with wafer rotation.

Jul 11, 2017