Welcome to Frontier Semiconductor

Frontier Semiconductor, Inc, (FSM), offers a range of advanced metrology products and solutions for semiconductor, LED, Solar, FPD, Data Storage and MEMS applications. We have over 25 years experience in stress measurement, film adhesion testing, wafer topography metrology, and electrical characterization. Our latest offerings include unique technology to meet the metrology needs of 3DIC manufacturing and to monitor stress of large flat panels.

FSM has local sales and support offices in all major semiconductor clusters. Other areas are covered by a network of local representatives.

Applications domains & Technologies

FSM offers metrology and characterization systems for front-end, back-end, as well as research and development applications.

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Products

21 Product lines... Click here for more details



RMS RMS

The FSM RMS In-Situ Roughness Monitoring System is a compact, robust, and easy to use system to measure the roughness of very rough surfaces such as those of diffusers for LED and Laser light sources, as well as silicon and compound semiconductor solar cells. FSM’s proprietary non-contact grazing angle scattering technology makes the system immune to stray light and vibration and easy to integrate.



8108 VITE VIT(E) Series

New high speed, high accuracy non-contact characterization of thin wafers, through silicon vias (TSV), bumps, MEMS structures and novel materials. FSM 8108 VITE can be employed in the front-end and backend. It provides thickness, TTV, and topography of Si and compound materials, edge trim geometry, multilayer thickness and topography of wafers on tape, on sapphie,or on glass. Measurement of warp of highly warped wafers and measurement of  thick films.



413 C2C 413 Series

Thickness and total thickness variation (TTV) mapping system. TTV and Thickness of wafer substrate, thick layers, wafers on tape, bonded wafers, etc. Fully automated cassette to cassette system, SECS/GEM compliant. Warp, Roughness, and Thin Film Thickness measurement options.

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FSM will be introducing the new FSM 8108 VITE system at the FCMN 2017 in Monterey. FSM 8108 VITE is based on the Frequency Space Moire Effect, which provides high speed, high accuracy dimensional metrology.

Mar 21, 2017

FSM will exhibit and present at 2017 MRS Spring Meeting. Booth number 504. Please visit.

Apr 17, 2017

FSM will exhibit at Semicon West July 11-13, 2017. Booth #5151. We will be introducing our latest metrology solutions for thinned wafer thickness measurement and other application. Talk to us also about our new high temperature vacuum characterization chamber with wafer rotation.

Jul 11, 2017