Frontier Semiconductor is the leading manufacturer of stress measurement tools for semiconductor, MEMS, optoelectronic, and flat panel applications. Stress and wafer bow maps can be acquired over the entire wafer surface, providing process engineers means to characterize and develop new processes using different thin film materials.
The FSM 128 Series systems are room temperature, full-wafer 2D/3D stress mapping systems. 128 systems use FSM's patented non-contact Opti-Lever dual-laser auto-switching technology. Ability to scan 1000 points per inch in seconds for high resolution, high precision stress mapping on blanked and patterned wafers.
Dedicated Film Stress mapping system with high resolution for high throughput process control. Fully automated cassette to cassette, SECS/GEM compliant 300mm Film Stress and Bow Measurement tool. Dual or single FOUP configurations available. Integrated wafer substrate thickness measurement available.
FSM will be introducing the new FSM 8108 VITE system at the FCMN 2017 in Monterey. FSM 8108 VITE is based on the Frequency Space Moire Effect, which provides high speed, high accuracy dimensional metrology.
FSM will exhibit and present at 2017 MRS Spring Meeting. Booth number 504. Please visit.
FSM will exhibit and present at FCMN 2017. We will be introducing our latest metrology solutions for thinned wafer thickness measurement and other application. Talk to us also about our new high temperature vacuum characterization chamber with wafer rotation.