Substrate and tape total and individual thicknesses, warpage, and TTV Measurement. Able to measure with or without backing tape. For wafer back-grind and etch thinning processes control. Non-contact Echoprobe or VITE Technology. Thin film and surface roughness options.
Thickness and total thickness variation (TTV) mapping system. TTV and Thickness of wafer substrate, thick layers, wafers on tape, bonded wafers, etc. Fully automated cassette to cassette system, SECS/GEM compliant. Warp, Roughness, and Thin Film Thickness measurement options.
FSM will be presenting and demonstrating Non-Contact Stress Metrology for Flexible Electronics at the 2018 FLEX Conference in Monterey CA, Feb. 12-15, 2018.Feb 12, 2018
FSM will be presenting at the ASMC 2018 in Saratoga Springs, NY.Apr 30, 2018
FSM will be presenting at the International Conference on Metallurgical Coatings and Thin Films (ICMCTF) in San Diego, CA.Apr 23, 2018