Substrate and tape total and individual thicknesses, warpage, and TTV Measurement. Able to measure with or without backing tape. For wafer back-grind and etch thinning processes control. Non-contact Echoprobe or VITE Technology. Thin film and surface roughness options.
413PR is specially designed for automatic substrate thickness measurement on wafers with optically turbid (milky) tapes, as well as for applications demanding fast, reliable, automatic measurement site location. Special optics and illumiation allow rapid location of areas of interest. Semi-automatic system with enclosure for wafers up to 300mm with or without frame..
Frontier Semiconductor moved to its new location: 165 Topaz St., Milpitas, CA 95035, USA.May 01, 2018
FSM will be presenting at Semicon West in San Francisco, Ca, July 9-11, 2019. Please visit us at booth #243 in the South Hall.Jul 09, 2019
FSM will be presenting at SPIE Photonics West in San Francisco, Ca, February 2 -7, 2019.Feb 02, 2019
FSM will be presenting at SPIE The international society for optics and photonics - DEFENSE COMMERCIAL SENSINGApr 16, 2019