Local and Lattice Stress Measurement, Die level Topography. For in-die and in-device stress and composition control.
Micro Raman system for lattice level strain and material composition measurement. High spectral resolution (0.02 cm-1) and sub micron lateral resolution. Measurement of through silicon via (TSV) keep out zone, local stress and composition profiling. Fully automated C2C system.
Frontier Semiconductor moved to its new location: 165 Topaz St., Milpitas, CA 95035, USA.May 01, 2018
FSM will be presenting at Semicon West in San Francisco, Ca, July 10-12, 2018. Please visit us at booth #2332 in the South Hall.Jul 10, 2018
FSM will be presenting at SPIE Optics and Photonics Conference in San Diego.Aug 20, 2018