Local and Lattice Stress Measurement, Die level Topography. For in-die and in-device stress and composition control.
Nano Topography and Stress of dies: 1nm vertical resolution in single images sized up to 30mm x 40mm. Fully automated cassette to cassette system.Semi-automated systems available as well.
FSM will be introducing the new FSM 8108 VITE system at the FCMN 2017 in Monterey. FSM 8108 VITE is based on the Frequency Space Moire Effect, which provides high speed, high accuracy dimensional metrology.
FSM will exhibit and present at 2017 MRS Spring Meeting. Booth number 504. Please visit.
FSM will exhibit at Semicon West July 11-13, 2017. Booth #5151. We will be introducing our latest metrology solutions for thinned wafer thickness measurement and other application. Talk to us also about our new high temperature vacuum characterization chamber with wafer rotation.