Virtual Interface Technology for 3D-IC Metrology: TSV profile (depth, top & bottom CD) , Remaining Silicon Thickness (RST), Copper Nail Height, Bump Height and Cu pillar Height, Edge trim profile.
Dimensional metrology system for 3D-IC application: Through Silicon Via (TSV) depth, top CD, bottom CD, remaining silicon thickness (RST), copper pillar height, bump height, and many more. Fully automated cassette to cassette system for 300mm wafers. SECS/GEM option. Warp, Roughness, and Thin Film Thickness measurement options.
FSM will be introducing the new FSM 8108 VITE system at the FCMN 2017 in Monterey. FSM 8108 VITE is based on the Frequency Space Moire Effect, which provides high speed, high accuracy dimensional metrology.
FSM will exhibit and present at 2017 MRS Spring Meeting. Booth number 504. Please visit.
FSM will exhibit and present at FCMN 2017. We will be introducing our latest metrology solutions for thinned wafer thickness measurement and other application. Talk to us also about our new high temperature vacuum characterization chamber with wafer rotation.