Film adhesion testing of thin films and stacks on substrates for material evaluation.
Modified Edge Liftoff Test to measure adhesion of thin film and thin film stacks on a wide variety of crystalline and non-crystaline substrates, such as Silicon, III-V compounds, glass, etc. Suitable for mid adhesion samples.
FSM will be presenting and demonstrating Non-Contact Stress Metrology for Flexible Electronics at the 2018 FLEX Conference in Monterey CA, Feb. 12-15, 2018.Feb 12, 2018
FSM will be presenting at the ASMC 2018 in Saratoga Springs, NY.Apr 30, 2018
FSM will be presenting at the International Conference on Metallurgical Coatings and Thin Films (ICMCTF) in San Diego, CA.Apr 23, 2018