Stress Hysteresis Measurement up to 500C for thermal property and stability tests of thin films in inert gas. Non-Contact Laser Scanning Technology.
Evaluate the thermal properties and stability (film stress) of thin films up to 500 degree C in inert gas. 200mm or 300mm chamber. Manually loading.
FSM will be introducing the new FSM 8108 VITE system at the FCMN 2017 in Monterey. FSM 8108 VITE is based on the Frequency Space Moire Effect, which provides high speed, high accuracy dimensional metrology.Mar 21, 2017
FSM will exhibit and present at 2017 MRS Spring Meeting. Booth number 504. Please visit.Apr 17, 2017
FSM will exhibit at Semicon West July 11-13, 2017. Booth #5151. We will be introducing our latest metrology solutions for thinned wafer thickness measurement and other application. Talk to us also about our new high temperature vacuum characterization chamber with wafer rotation.Jul 11, 2017