Welcome to Frontier Semiconductor

Frontier Semiconductor USA has moved. Our new address is 165 Topaz St., Milpitas, CA 95035. Our phone number remained +1-408-432-8838.

Frontier Semiconductor (FSM), offers a range of advanced metrology products and solutions for semiconductor, LED, Solar, FPD, Data Storage and MEMS applications. We have over 25 years experience in stress measurement, film adhesion testing, wafer topography metrology, and electrical characterization. Our latest offerings include unique technology to meet the metrology needs of 3DIC manufacturing and to monitor stress of large flat panels.

FSM has local sales and support offices in all major semiconductor clusters. Other areas are covered by a network of local representatives.

Applications domains & Technologies

FSM offers metrology and characterization systems for front-end, back-end, as well as research and development applications.



15 Product lines... Click here for more details

413 C2C 413 Series

Thickness and total thickness variation (TTV) mapping system. TTV and Thickness of wafer substrate, thick layers, wafers on tape, bonded wafers, etc. Fully automated cassette to cassette system, SECS/GEM compliant. Warp, Roughness, and Thin Film Thickness measurement options.

128L C2C 128 Series

Dedicated Film Stress mapping system with high resolution for high throughput process control. Fully automated cassette to cassette, SECS/GEM compliant 300mm Film Stress and Bow Measurement tool. Dual or single FOUP configurations available. Integrated wafer substrate thickness measurement available. 


900 C2C 900 Series

Rapid Thermal Mechanical Characterization of novel materials. Simulataneous extraction of stress hysteresis, thermal desorption, film shrinkage and reflectivity data during thermal cycling in vaccum up to 900 degree C. Fully automated cassette to cassette system for 300mm wafers. SECS/GEM option.

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