Substrate and tape total and individual thicknesses, warpage, and TTV Measurement. Able to measure with or without backing tape. For wafer back-grind and etch thinning processes control. Non-contact Echoprobe or VITE Technology. Thin film and surface roughness options.
Thickness and total thickness variation (TTV) mapping system. TTV and Thickness of wafer substrate, thick layers, wafers on tape, bonded wafers, etc. Fully automated cassette to cassette system, SECS/GEM compliant. Warp, Roughness, and Thin Film Thickness measurement options.
Frontier Semiconductor moved to its new location: 165 Topaz St., Milpitas, CA 95035, USA.May 01, 2018
FSM will be presenting at Semicon West in San Francisco, Ca, July 9-11, 2019. Please visit us at booth #243 in the South Hall.Jul 09, 2019
FSM will be presenting at SPIE Photonics West in San Francisco, Ca, February 2 -7, 2019.Feb 02, 2019