In IC device manufacturing electrical characteristics of layers and films must be well controlled. Conventional contact test methods on monitor wafers, like the 4-point probe method, do no longer meet modern requirements. State of the art IC feature extremely thin junctions, often only a few atomic layers of material. FSM's contactless RsL probe for sheet resistance and leakage to meet the challenge to characterize ultra shallow junctions.For sheet resistance measurement of thicker junctions and metal layers FSM offers four-point probe systems.
FSM will be presenting and demonstrating Non-Contact Stress Metrology for Flexible Electronics at the 2018 FLEX Conference in Monterey CA, Feb. 12-15, 2018.Feb 12, 2018
FSM will be presenting at the ASMC 2018 in Saratoga Springs, NY.Apr 30, 2018
FSM will be presenting at the International Conference on Metallurgical Coatings and Thin Films (ICMCTF) in San Diego, CA.Apr 23, 2018