In IC device manufacturing electrical characteristics of layers and films must be well controlled. Conventional contact test methods on monitor wafers, like the 4-point probe method, do no longer meet modern requirements. State of the art IC feature extremely thin junctions, often only a few atomic layers of material. FSM's contactless RsL probe for sheet resistance and leakage to meet the challenge to characterize ultra shallow junctions.For sheet resistance measurement of thicker junctions and metal layers FSM offers four-point probe systems.
FSM will be introducing the new FSM 8108 VITE system at the FCMN 2017 in Monterey. FSM 8108 VITE is based on the Frequency Space Moire Effect, which provides high speed, high accuracy dimensional metrology.Mar 21, 2017
FSM will exhibit and present at 2017 MRS Spring Meeting. Booth number 504. Please visit.Apr 17, 2017
FSM will exhibit at Semicon West July 11-13, 2017. Booth #5151. We will be introducing our latest metrology solutions for thinned wafer thickness measurement and other application. Talk to us also about our new high temperature vacuum characterization chamber with wafer rotation.Jul 11, 2017