Film adhesion tests are a critical step in film process development and reliability control. Adhesive failures indicate voids, contamination, and/or composition variations in a film. FSM offers systems testing in air as well as in liquid. Testing in liquid reveals the effect of solutions on the material's cohesive strength and interfaces.
FSM will be presenting and demonstrating Non-Contact Stress Metrology for Flexible Electronics at the 2018 FLEX Conference in Monterey CA, Feb. 12-15, 2018.Feb 12, 2018
FSM will be presenting at the ASMC 2018 in Saratoga Springs, NY.Apr 30, 2018
FSM will be presenting at the International Conference on Metallurgical Coatings and Thin Films (ICMCTF) in San Diego, CA.Apr 23, 2018