Stress Hysteresis in vacuum or gas up to 900C for the study of annealing cycles. Thermal Desorption, Film Shrinkage, Reflectivity, and Resistivity options provide additional insight to causes of material changes with temperature. NEW: Optional wafer rotation offers unique 2D/3D mapping to study wafer deformation as a function of temperature.
Multi-Probe Vacuum Integrated Metrology System is a unique integrated metrology system to measure film stress and wafer bow height during thermal annealing and cooling cycles. It features a vacuum heating chamber. Heating and cooling can be done in vacuum to prevent oxidation or in gas environment to mimic process conditions. Besides bow height and stress measurement, it can be configured to provide more process information by the following optional probes:
A) Thermal Desorption Spectroscopy (TDS) to measure outgassing species
B) Film Thickness
D) 4 Point Probe
Features, Advantages, and Benefits:
1) FSM 900TC-Vac can be operated in vacuum or inert gas to mimic process conditions.
2) Bow height measurements acquire >12,000 points per scan for a 300mm wafer providing high accuracy and the ability to measure on patterned wafers.
3) Measurements can be performed up to 9000 C in vacuum covering most process conditions.
4) Simultaneous measurement using different probes can be performed allowing accurate correlations of data, such as stress vs. outgassing species, and/or vs film thickness change, etc.
5) The multiprobe software is integrated for easy operation.
6) The system meets Semi S2/S8 safety compliance to pass customers’ safety requirements.