3DIC TSV Process Control
3DIC manufacturing is facing enormous process control issues. FSM developed an innovative technology to meet the process control needs of TSV creation, copper reveal, and bump height measurement.
413 Series
Substrate Thickness, Warp, and TTV Measurement
with or without Tape
for Wafer Backgrind and Etch Thinning processes.
Non-contact Echoprobe Technology.
Thin film and surface roughness options.
413 C2C 413 SA 413MOT
413 C2C 413 SA 413MOT
