3DIC TSV Process Control

3DIC manufacturing is facing enormous process control issues. FSM developed an innovative technology to meet the process control needs of TSV creation, copper reveal, and bump height measurement.

413 Series

Products.php?applicationid=1&category=413+Series&type=3
Substrate Thickness, Warp, and TTV Measurement with or without Tape for Wafer Backgrind and Etch Thinning processes. Non-contact Echoprobe Technology. Thin film and surface roughness options.

413 C2C 413 SA 413 PR 413MOT

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Frontier Semiconductor moved to its new location: 165 Topaz St., Milpitas, CA 95035, USA.

May 01, 2018

FSM will be presenting at Semicon West in San Francisco, Ca,  July 9-11, 2019. Please visit us at booth #243 in the South Hall.

Jul 09, 2019

FSM will be presenting at SPIE Photonics West in San Francisco, Ca, February 2 -7, 2019. 

Feb 02, 2019