Thinning and backgrinding of wafers requires precise control of thickness, total thickness variation (TTV) and warp. FSM offers solutions for measurement of wafers and wafers on tape.
Frontier Semiconductor moved to its new location: 165 Topaz St., Milpitas, CA 95035, USA.May 01, 2018
FSM will be presenting at Semicon West in San Francisco, Ca, July 10-12, 2018. Please visit us at booth #2332 in the South Hall.Jul 10, 2018
FSM will be presenting at the ASMC 2018 in Saratoga Springs, NY.Apr 30, 2018
FSM will be presenting at the International Conference on Metallurgical Coatings and Thin Films (ICMCTF) in San Diego, CA.Apr 23, 2018