Thinning and backgrinding of wafers requires precise control of thickness, total thickness variation (TTV) and warp. FSM offers solutions for measurement of wafers and wafers on tape.
FSM will be presenting and demonstrating Non-Contact Stress Metrology for Flexible Electronics at the 2018 FLEX Conference in Monterey CA, Feb. 12-15, 2018.Feb 12, 2018
FSM will be presenting at the ASMC 2018 in Saratoga Springs, NY.Apr 30, 2018
FSM will be presenting at the International Conference on Metallurgical Coatings and Thin Films (ICMCTF) in San Diego, CA.Apr 23, 2018