Film stress and and wafer bow measurements are an integral part in the process of reliability monitoring of deposited thin films during the chip making process.
Stress monitoring has become increasingly critical with the advent of 3D integrated circuits.
There are three types of film stress: global, local, and lattice level stress. FSM offers solutions for all three types in our 128/500/900 Series, 127 Series, and Raman 360 tools.
Stress Hysteresis Measurement up to 500C for thermal property and stability tests of thin films in air.
Stress Hysteresis in vacuum or gas up to 900C for the study of annealing cycles. Thermal Desorption, Film Shrinkage, Reflectivity, and Resistivity options provide additional insight to causes of material changes with temperature.
FSM will be presenting and demonstrating Non-Contact Stress Metrology for Flexible Electronics at the 2018 FLEX Conference in Monterey CA, Feb. 12-15, 2018.Feb 12, 2018
FSM will be presenting at the ASMC 2018 in Saratoga Springs, NY.Apr 30, 2018
FSM will be presenting at the International Conference on Metallurgical Coatings and Thin Films (ICMCTF) in San Diego, CA.Apr 23, 2018