Film stress and and wafer bow measurements are an integral part in the process of reliability monitoring of deposited thin films during the chip making process.
Stress monitoring has become increasingly critical with the advent of 3D integrated circuits.
There are three types of film stress: global, local, and lattice level stress. FSM offers solutions for all three types in our 128/500/900 Series, 127 Series, and Raman 360 tools.
Stress Hysteresis Measurement up to 500C for thermal property and stability tests of thin films in air.
Stress Hysteresis in vacuum or gas up to 900C for the study of annealing cycles. Thermal Desorption, Film Shrinkage, Reflectivity, and Resistivity options provide additional insight to causes of material changes with temperature.
FSM will be introducing the new FSM 8108 VITE system at the FCMN 2017 in Monterey. FSM 8108 VITE is based on the Frequency Space Moire Effect, which provides high speed, high accuracy dimensional metrology.
FSM will exhibit and present at 2017 MRS Spring Meeting. Booth number 504. Please visit.
FSM will exhibit and present at FCMN 2017. We will be introducing our latest metrology solutions for thinned wafer thickness measurement and other application. Talk to us also about our new high temperature vacuum characterization chamber with wafer rotation.