FSM uses patented Laser Scanning technology to measure the radius of curvature and bow of wafers. A laser beam is directed to the wafer. The beam is reflected at an angle that corresponds to the radius of curvature of the wafer.
FSM will be presenting and demonstrating Non-Contact Stress Metrology for Flexible Electronics at the 2018 FLEX Conference in Monterey CA, Feb. 12-15, 2018.Feb 12, 2018
FSM will be presenting at the ASMC 2018 in Saratoga Springs, NY.Apr 30, 2018
FSM will be presenting at the International Conference on Metallurgical Coatings and Thin Films (ICMCTF) in San Diego, CA.Apr 23, 2018