FSM uses patented Laser Scanning technology to measure the radius of curvature and bow of wafers. A laser beam is directed to the wafer. The beam is reflected at an angle that corresponds to the radius of curvature of the wafer.
FSM will be introducing the new FSM 8108 VITE system at the FCMN 2017 in Monterey. FSM 8108 VITE is based on the Frequency Space Moire Effect, which provides high speed, high accuracy dimensional metrology.
FSM will exhibit and present at 2017 MRS Spring Meeting. Booth number 504. Please visit.
FSM will exhibit and present at FCMN 2017. We will be introducing our latest metrology solutions for thinned wafer thickness measurement and other application. Talk to us also about our new high temperature vacuum characterization chamber with wafer rotation.